✦ LIBER ✦
Direct wafer bonding and layer transfer-a new approach to integration of ferroelectric oxides into silicon technology
✍ Scribed by Alexe, M.; Senz, St.; Pignolet, A.; Hesse, D.; Gösele, U.
- Book ID
- 126895402
- Publisher
- Taylor and Francis Group
- Year
- 1999
- Tongue
- English
- Weight
- 884 KB
- Volume
- 231
- Category
- Article
- ISSN
- 0015-0193
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