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Silicon Wafer Bonding by Chemical Assembly of a Surface by Molecular Layering and Gas Cutting

✍ Scribed by A.L. Suvorov; V.I. Grafutin; A.G. Zaluzhnyi; M.A. Kozodaev; E.P. Prokopiev; B.Yu. Sharkov; S.P. Timoshenkov; Yu.A. Chaplygin; V.F. Reutov

Book ID: 110325243
Publisher: Springer US
Year: 2001
Tongue: English
Weight: 76 KB
Volume: 91
Category: Article
ISSN: 1573-8205
DOI: 10.1023/a:1013888021077

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