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Three-dimensional Monte Carlo simulation of sputtered atom transport in the process of ion-plasma sputter deposition of multicomponent thin films

โœ Scribed by P.K. Petrov; V.A. Volpyas; R.A. Chakalov


Publisher
Elsevier Science
Year
1999
Tongue
English
Weight
197 KB
Volume
52
Category
Article
ISSN
0042-207X

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โœฆ Synopsis


An algorithm for Monte Carlo simulation of sputtered atom transport during ion-plasma sputtering was developed. The experimentally determined initial energy distribution of sputtered atoms, the influence of the background gas mixture and the real equipment geometry of the magnetron sputtering system were taken into account. To describe the collision between sputtered atoms and background gas atoms, the Firsov interatomic potential with Nikulin screen function was used. In simulations, the equipment geometry and deposition conditions were chosen corresponding to those of DC magnetron deposition of Cu and YBa Cu O \V thin films. The spatial, energetic and angular distribution of sputtered atoms on the substrate surface, target and chamber's walls were calculated. The obtained results are in good agreement with experimental ones. The presented simulation procedure is useful in daily research work to choose the optimal deposition conditions for both on-and off-axis magnetron deposition systems. 1999 Elsevier Science Ltd. All rights reserved.


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โœ PK Petrov; VA Volpyas; EK Hollmann; T Tanaka; K Kawabata ๐Ÿ“‚ Article ๐Ÿ“… 1997 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 205 KB

## RFpower and DC bias have been simultaneously applied to the target in a conventional magnetron sputtering system in order to control the growth kinetics of W thin films using argon gas for sputtering. A Monte Carlo simulation based on physical models of ion-plasma sputtering was carried out to st