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Thin copper films deposited by low temperature plasma-enhanced metal organic chemical vapour deposition using copper-acetylacetonate

✍ Scribed by A. Hamerich; L. Lottermoser; J. Müller


Publisher
Elsevier Science
Year
1993
Tongue
English
Weight
436 KB
Volume
59
Category
Article
ISSN
0257-8972

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Copper thin films prepared by chemical v
✍ T. Maruyama; T. Shirai 📂 Article 📅 1995 🏛 Springer 🌐 English ⚖ 493 KB

Copper thin films were prepared by a low-temperature atmospheric pressure chemical vapour deposition method. The raw material was copper (11) acetylacetonate. At a reaction temperature above 220 ~ polycrystalline copper films can be obtained by hydrogen reduction of the raw material. The resistivity