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Thermal nanoimprint resist for the fabrication of high-aspect-ratio patterns

✍ Scribed by Messerschmidt, M.; Schleunitz, A.; Spreu, C.; Werner, T.; Vogler, M.; Reuther, F.; Bertz, A.; Schift, H.; Grützner, G.

Book ID
121302804
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
432 KB
Volume
98
Category
Article
ISSN
0167-9317

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Multi-layered resist process for nanoimprint lithography is newly proposed to fabricate high aspect ratio pattern under low pressured condition. A low molecular weight polymer is coated on a high molecular weight polymer and a mold is pressed to the bi-layered resist structure over the glass transit