β Scribed by W.H. Cleghorn; D.H. Warrington; J.M. West
No coin nor oath required. For personal study only.
The tie structure of thin films of chromium electrodeposited on fee substrates has been investigated by electron microscopy, in an attempt to relate substrate/deposit epitaxy to the development of high internal stress in the deposits. The structure of these tlhns has been found to be insensitive to changes in deposition varrables, but the epitaxial relationship with the substrate varies markedly with substrate lattice parameter and state of preparation.
Chromium ti show certain similarities of structure and orientation with electrodeposits of other metals, in spite of great differences in the deposition overpotential.
It is proposed that epitaxy is more important in determining the mode of coalescence of adjacent chromium nuclei, than in generating an epitaxial misfit stress at the deposit/substrate interface. Some unusual diffraction effects, produced by the very fine crystalline size of the deposit, are described and analysed.
π SIMILAR VOLUMES
An X-ray diffraction study was made of copper electrodeposited on low index planes of copper single crystals . Three characteristic stages occur during the process : (a) epitaxial growth, (b) twin development, (c) polycrystalline growth . The deposit thickness, Ah, attained just before polycrystall
The surface topography of copper deposits, grown from acid copper sulphate solutions on electropolished copper cathodes, varies with the orientation of the original cathode surface. The deposit structures fall into groups which may be related to the atomic configuration of the original cathode surf