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The influence of addition of nanosized molybdenum and nickel particles on creep behavior of Sn–Ag lead free solder alloy

✍ Scribed by V.L. Niranjani; B.S.S. Chandra Rao; Rajdeep Sarkar; S.V. Kamat


Book ID
118461429
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
771 KB
Volume
542
Category
Article
ISSN
0925-8388

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