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Effect of silver and indium addition on mechanical properties and indentation creep behavior of rapidly solidified Bi–Sn based lead-free solder alloys

✍ Scribed by Rizk Mostafa Shalaby

Book ID
119330593
Publisher
Elsevier Science
Year
2013
Tongue
English
Weight
1004 KB
Volume
560
Category
Article
ISSN
0921-5093

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