Optical, electrical and structural prope
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N. Ahner; S.E. Schulz; F. Blaschta; M. Rennau
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Article
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2008
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Elsevier Science
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English
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Looking onto application of low-k and ultra low-k materials within FEOL, high temperature load is one of the major challenges. But also temperature ranges below standard curing conditions are of special interest, e.g. for integration of transparent low-k materials into optical devices due to their s