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The coupling effects of thermal cycling and high current density on Sn58Bi solder joints

✍ Scribed by Zuo, Yong; Ma, Limin; Liu, Sihan; Wang, Ting; Guo, Fu; Wang, Xitao


Book ID
118801492
Publisher
Springer
Year
2012
Tongue
English
Weight
764 KB
Volume
48
Category
Article
ISSN
0022-2461

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