An X-ray Radiography Study of the Effect of Thermal Cycling on Damage Evolution in Large-Area Sn-3.5Ag Solder Joints

✍ Scribed by Govindarajan Muralidharan, Kanth Kurumaddali, Andrew K. Kercher, Larry Walker, Scott G. Leslie

• Book ID: 118816488
• Publisher: Springer US
• Year: 2012
• Tongue: English
• Weight: 817 KB
• Volume: 42
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-012-2341-x