Flip-chip technology is a face-down attachment of the active side of the silicon device onto the substrate. It is the ultimate packaging solution to integrated circuit devices used in 21st century electronic systems to meet the requirements of small size, high performance, and low cost. Underfill te
Syntheses and characterizations of thermally reworkable epoxy resins. Part I
β Scribed by Lejun Wang; C. P. Wong
- Publisher
- John Wiley and Sons
- Year
- 1999
- Tongue
- English
- Weight
- 238 KB
- Volume
- 37
- Category
- Article
- ISSN
- 0887-624X
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β¦ Synopsis
To meet the need for reworkable epoxy resins, a series of cycloaliphatic diepoxides containing thermally cleavable carbamate linkages were synthesized and characterized. These materials were shown to undergo curing reactions with cyclic anhydride in a similar fashion as a commercial cycloaliphatic epoxide, except that the carbamate group within the diepoxides can act as the internal catalyst. Furthermore, cured samples of the formulations from these diepoxides started to decompose at lower temperatures, i.e., between 200 -300Β°C as compared with 350Β°C for the cured sample of the commercial cycloaliphatic epoxide, which showed their potential to be used as reworkable underfill encapsulants in the electronic packaging area.
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