A new silicon-containing oxirane triglycidyl phenyl silane oxide (TGPSO) and its corresponding silicon-containing epoxy resins are synthesized and characterized. The activation energies of TGPSO curing reaction with various curing agents, including 4,4-diaminodiphenylmethane, 4,4-diaminodiphenylsulf
Synthesis, characterization, thermal, and flame retardant properties of phosphate-based epoxy resins
β Scribed by Ying-Ling Liu; Ging-Ho Hsiue; Yie-Shun Chiu
- Publisher
- John Wiley and Sons
- Year
- 1997
- Tongue
- English
- Weight
- 197 KB
- Volume
- 35
- Category
- Article
- ISSN
- 0887-624X
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β¦ Synopsis
A new phosphorus-containing oxirane bis-glycidyl phenylphosphate (BGPP), and a diamine, bis(4-aminophenyl)phenylphosphate (BAPP), were synthesized. Both of these two phosphorus-containing compounds lead to phosphate-containing epoxy resin via curing reaction. The kinetics of the curing reaction of BGPP with various curing agents, including BAPP, were studied. The introduction of electronwithdrawing group into the compounds increases the BGPP and decreases the BAPP reactivity in the curing reaction. The thermal and the weight loss behavior of the cured epoxy resins were studied by TGA. High char yields (32-52%) as well as high limiting oxygen index (LOI) values (34-49) of these phosphorylated resins were found, confirming the usefulness of these phosphorus-containing epoxy resins as flame retardants.
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