Investigation of interdiffusion in coppe
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Ahmed M. Abdul-Lettif
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Article
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2007
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Elsevier Science
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English
β 186 KB
Auger depth profiling technique and X-ray diffraction analysis have been employed to study the interdiffusion in vacuum-deposited copper-nickel bilayer thin films. An adaptation of the Whipple model was used to determine the diffusion coefficients of both nickel in copper and copper in nickel. The c