𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Suppression of Interdiffusion in Copper/Tin Thin Films

✍ Scribed by Harald Etschmaier, Holger Torwesten, Hannes Eder, Peter Hadley


Book ID
113087499
Publisher
Springer US
Year
2012
Tongue
English
Weight
413 KB
Volume
21
Category
Article
ISSN
1059-9495

No coin nor oath required. For personal study only.


πŸ“œ SIMILAR VOLUMES


Investigation of interdiffusion in coppe
✍ Ahmed M. Abdul-Lettif πŸ“‚ Article πŸ“… 2007 πŸ› Elsevier Science 🌐 English βš– 186 KB

Auger depth profiling technique and X-ray diffraction analysis have been employed to study the interdiffusion in vacuum-deposited copper-nickel bilayer thin films. An adaptation of the Whipple model was used to determine the diffusion coefficients of both nickel in copper and copper in nickel. The c

Interdiffusion in Thin Films
✍ Tu, K N πŸ“‚ Article πŸ“… 1985 πŸ› Annual Reviews 🌐 English βš– 980 KB