𝔖 Bobbio Scriptorium
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3112. Interdiffusion in composition-modulated copper-gold thin films


Book ID
108389699
Publisher
Elsevier Science
Year
1977
Tongue
English
Weight
133 KB
Volume
27
Category
Article
ISSN
0042-207X

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Investigation of interdiffusion in coppe
✍ Ahmed M. Abdul-Lettif πŸ“‚ Article πŸ“… 2007 πŸ› Elsevier Science 🌐 English βš– 186 KB

Auger depth profiling technique and X-ray diffraction analysis have been employed to study the interdiffusion in vacuum-deposited copper-nickel bilayer thin films. An adaptation of the Whipple model was used to determine the diffusion coefficients of both nickel in copper and copper in nickel. The c