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Superconformal filling of 41 nm trenches with Cu electroless deposition on Au-activated self-assembled monolayer

✍ Scribed by W.K. Han; G.H. Hwang; S.J. Hong; H.H. An; C.S. Yoon; J.H. Kim; M.J. Lee; G. Hong; K.S. Park; S.G. Kang

Book ID: 113783633
Publisher: Elsevier Science
Year: 2010
Tongue: English
Weight: 533 KB
Volume: 123
Category: Article
ISSN: 0254-0584
DOI: 10.1016/j.matchemphys.2010.04.029

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