✦ LIBER ✦
Complete filling of 41 nm trench pattern using Cu seed layer deposited by SAM-modified electroless plating and electron-beam evaporation
✍ Scribed by W.K. Han; G.H. Hwang; S.J. Hong; H.H. An; C.S. Yoon; J.H. Kim; M.J. Lee; G. Hong; K.S. Park; S.G. Kang
- Book ID
- 108064196
- Publisher
- Elsevier Science
- Year
- 2010
- Tongue
- English
- Weight
- 745 KB
- Volume
- 256
- Category
- Article
- ISSN
- 0169-4332
No coin nor oath required. For personal study only.