Conformal electroless deposition of Cu seed layer on a 60-nm trench pattern modified with a self-assembled monolayer

✍ Scribed by Won-Kyu Han; Gil-Ho Hwang; Seok-Jun Hong; Soo-Seok Kim; Chong-Seung Yoon; Noh-Jung Kwak; Seung-Jin Yeom; Jae-Hong Kim; Sung-Goon Kang

• Book ID: 104052103
• Publisher: Elsevier Science
• Year: 2009
• Tongue: English
• Weight: 385 KB
• Volume: 86
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2008.11.024