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Study of diffusion and atomic mobilities for fcc Ag–Cd and Ag–Sn solder alloys

✍ Scribed by Yajun Liu; Jiang Wang; Yong Du; Guang Sheng; Lijun Zhang; Dong Liang


Book ID
116332294
Publisher
Elsevier Science
Year
2011
Tongue
English
Weight
750 KB
Volume
35
Category
Article
ISSN
0364-5916

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