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A study of microstructural development, hardness and micro-creep of Sn-3.5Ag-0.7Cu lead-free solder alloy prepared by rapid solidification

✍ Scribed by El Said Gouda

Book ID: 111632865
Publisher: Springer-Verlag
Year: 2011
Tongue: English
Weight: 673 KB
Volume: 126
Category: Article
ISSN: 2190-5444
DOI: 10.1140/epjp/i2011-11084-x

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