Structure and electrical properties of thin copper films deposited by MOCVD
✍ Scribed by J. Röber; C. Kaufmann; T. Gessner
- Publisher
- Elsevier Science
- Year
- 1995
- Tongue
- English
- Weight
- 872 KB
- Volume
- 91
- Category
- Article
- ISSN
- 0169-4332
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