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Structural, optical and electrical characterization of porous silicon prepared on thin silicon epitaxial layer

✍ Scribed by M. Balarin; O. Gamulin; M. Ivanda; M. Kosović; D. Ristić; M. Ristić; S. Musić; K. Furić; D. Krilov; J. Brnjas-Kraljević


Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
763 KB
Volume
924-926
Category
Article
ISSN
0022-2860

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✦ Synopsis


Silicon-on insulator (SOI) wafers, consisting of 22 lm thick p-type silicon epitaxial layer grown on 280 lm thick n-type (1 1 1) silicon substrate, were electrochemically etched in hydrofluoric acid (HF) to produce porous silicon (PS) samples. The pores of different size and different depth were obtained by etching at different time duration, from 10 to 80 min, using the constant concentration of 48% HF in ethanol solution. The structural and optical properties of porous layers were investigated by Raman, FTIR and photoluminescence (PL) spectroscopy, and scanning electron microscopy. SEM images showed high density of micrometer-sized pores whose morphology and density depended on the etching duration. For all samples the observed PL peak is in the visible spectral range. The intensity of the PL peak was increased with the etching time. The exception was the epitaxial layer of the sample etched for 80 min. It showed the strong decrease in the PL peak intensity. For this sample the insulator layer was completely etched out and the epitaxial layer was detached from the substrate. Fine nanometer-sized pores with the strong photoluminescence were observed in the substrate layer. The fine silicon nanostructure was confirmed by the broadening and the red-shift of crystalline silicon TO(C) vibrational band that indicates a strong phonon confinement.


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✍ M. Balarin; O. Gamulin; M. Ivanda; V. Djerek; O. Celan; S. Music; M. Ristic; K. 📂 Article 📅 2007 🏛 Elsevier Science 🌐 English ⚖ 743 KB

Porous silicon (PSi) samples were prepared by electrochemical etching of silicon-on-insulator wafers, consisting of 45 m thick p-type (111) silicon epitaxial layer grown on a thin 100 nm SiO 2 layer on silicon substrates, by varying the concentration of 48% HF in ethanol solution. Within the epitaxi