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Stress Isolation Used In MEMS Resonant Pressure Sensor Package

✍ Scribed by Yuxin Li; Deyong Chen; Junbo Wang

Book ID: 119355595
Publisher: Elsevier
Year: 2011
Tongue: English
Weight: 596 KB
Volume: 25
Category: Article
ISSN: 1877-7058
DOI: 10.1016/j.proeng.2011.12.113

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