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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Piezoresistive pressure sensors based on system in packaging technology of MEMS

✍ Scribed by Xiong Shi, ; Jian Xu, ; Zhiyin Gan, ; Sheng Liu,

Book ID: 118260502
Publisher: IEEE
Year: 2010
Weight: 696 KB
Volume: 0
Category: Article
ISBN: 1424481406
DOI: 10.1109/icept.2010.5582806

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