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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Optimization of packaging process of piezoresistive engine oil pressure sensor

✍ Scribed by Zongyang Zhang, ; Chaojun Liu, ; Zhimin Wan, ; Gang Cao, ; Yun Lu, ; Bin Song, ; Liu, Sheng

Book ID: 118260503
Publisher: IEEE
Year: 2010
Weight: 831 KB
Volume: 0
Category: Article
ISBN: 1424481406
DOI: 10.1109/icept.2010.5582815

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