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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - The influence of package thermal resistance on the EMP injection damage effect of transistors

✍ Scribed by Ren Xingrong, ; Chai Changchun, ; Ma Zhenyang, ; Yang Yintang, ; Wang Jing, ; Ren Lihua,

Book ID: 120211827
Publisher: IEEE
Year: 2010
Weight: 599 KB
Category: Article
ISBN: 1424481406
DOI: 10.1109/ICEPT.2010.5582767

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