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[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Thermal analysis and comparison of heat dissipation methods on high-power LEDs

✍ Scribed by Lei Liu, ; Zhang, G.Q.; Daoguo Yang, ; Kailin Pan, ; Hong Zhong, ; Fengze Hou,

Book ID: 121352230
Publisher: IEEE
Year: 2010
Weight: 926 KB
Category: Article
ISBN: 1424481406
DOI: 10.1109/ICEPT.2010.5582816

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