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Stress and stress relief in dielectric thin films – the role of hydrogen

✍ Scribed by R.G. Elliman; T.D.M. Weijers-Dall; M.G. Spooner; Tae-Hyun Kim; A.R. Wilkinson


Publisher
Elsevier Science
Year
2006
Tongue
English
Weight
153 KB
Volume
249
Category
Article
ISSN
0168-583X

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The buckling method is presently one of the most commonly used methods in residual stress measurement, but still suffers from the problem that an array of structures occupying a large die area is required. In this paper, the buckling characteristics of annular thin plates were investigated and a new