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Stress and density of defects in Si-doped GaN

✍ Scribed by Chine, Z. ;Rebey, A. ;Touati, H. ;Goovaerts, E. ;Oueslati, M. ;Jani, B. El ;Laugt, S.


Publisher
John Wiley and Sons
Year
2006
Tongue
English
Weight
684 KB
Volume
203
Category
Article
ISSN
0031-8965

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✦ Synopsis


Abstract

We report a study by photoluminescence (PL), Raman scattering, and highly resolved X‐ray diffraction (HRXRD) of a series of Si‐doped n‐type GaN layers grown by metalorganic vapor phase epitaxy (MOVPE) on sapphire (0001) with the carrier concentration of 2.3 Γ— 10^17^ – 9 Γ— 10^18^ cm^–3^. We found that the band gap reduction deduced from the PL spectra analysis is due to both band gap narrowing (BGN) effect and change of the nature of stress in the GaN:Si layers. The HRXRD spectra show that at high Si‐doping levels (>1.6 Γ— 10^18^ cm^–3^) the GaN films become under tensile stress. Progressive decreases of the E~2~ Raman mode frequency with Si concentration confirm this observation. The stress induced E~2~ mode frequency shift is estimated to 1.6 cm^–1^/GPa. Additionally, dislocation densities are determined by HRXRD by employing a model that uses the line width of X‐ray rocking curves. Atomic force microscopy (AFM) is also used to investigate the defect surface structures of GaN:Si layers which are dominated by pinned steps and surface depressions related to threading dislocations. We find that dislocation densities given by AFM measurements are in agreement with those obtained from rocking curve line widths. (Β© 2006 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)


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