✦ LIBER ✦

Soldering-induced Cu diffusion and intermetallic compound formation between Ni/Cu under bump metallization and SnPb flip-chip solder bumps

✍ Scribed by Chien-Sheng Huang; Guh-Yaw Jang; Jenq-Gong Duh

No coin nor oath required. For personal study only.

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