Reliability of ECL 100k devices using AI (4% wt Cu, 1% wt Si) double level metalisation, isoplanar technology with shallow, 0.25 #m, base-emitter junctions was evaluated by means of high current and high temperature stresses. Three failure modes connected with electromigration phenomena were found i
โฆ LIBER โฆ
Solder pastes for microelectronics: Ronald P. Anjard, Sr. Microlectron. J. 15 (2), 53 (1984)
- Book ID
- 108361333
- Publisher
- Elsevier Science
- Year
- 1985
- Tongue
- English
- Weight
- 88 KB
- Volume
- 16
- Category
- Article
- ISSN
- 0026-2692
No coin nor oath required. For personal study only.
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