Quality solder paste systems for use in microelectronic applications: Ronald P. Anjard, Sr. Solid St. Technol 183 (October 1983)

• Book ID: 104157432
• Publisher: Elsevier Science
• Year: 1986
• Tongue: English
• Weight: 93 KB
• Volume: 17
• Category: Article
• ISSN: 0026-2692
• DOI: 10.1016/s0026-2692(86)80030-1

✦ Synopsis

This capacitor is located just under the device, but not under the conductor I/O to avoid a parasitic capacitive coupling. With the coming of leadless and leaded full array chip carriers such as pin grid array, we applied the same concept with a capacitor inside the cap. The results with different current-pulse signals show the effects of the capacitor's inductance, resistance, and capacitance. The main specifications of this new chip carrier will be presented. In addition to improving speed and electrical performances, the IDCCC allows an increase in density and in reliability level.