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Solder bumper formation using electroless plating and ultrasonic soldering

โœ Scribed by Inaba, M.; Yamakawa, K.; Iwase, N.

Book ID
117872691
Publisher
IEEE
Year
1990
Tongue
English
Weight
449 KB
Volume
13
Category
Article
ISSN
0148-6411

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Thermal cycling effects on Sn/Pb solder and electroless Cu-plated AIN substrates are investigated. X-ray diffraction patterns reveal the existence of Cu20 for the electroless Cu-plated AIN after thermal cycling in an environmental chamber. Moisture in the chamber results in the oxidation of electrol