✦ LIBER ✦

Effect of electroless plating Ni–Cu–P layer on the wettability between cemented carbides and soldering tins

✍ Scribed by Liu Zhu; Laima Luo; Juan Luo; Jian Li; Yucheng Wu

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Electroless plating of Cu–Ni–P alloy on

✍ Xueping Gan; Yating Wu; Lei Liu; Bin Shen; Wenbin Hu 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 767 KB

Effect of Ni–P thickness on solid-state

✍ Aditya Kumar; Zhong Chen; S.G. Mhaisalkar; C.C. Wong; Poi Siong Teo; Vaidhyanath 📂 Article 📅 2006 🏛 Elsevier Science 🌐 English ⚖ 804 KB

Effect of metal/ceramic nanoparticle-dop

✍ J. Shen; Y.C. Chan 📂 Article 📅 2009 🏛 Elsevier Science 🌐 English ⚖ 915 KB

The effect of isothermal aging on the th

✍ Dae-Gon Kim; Seung-Boo Jung 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 669 KB

Effect of Ni layer thickness and solderi

✍ Won Kyoung Choi; Hyuck Mo Lee 📂 Article 📅 1999 🏛 Springer US 🌐 English ⚖ 314 KB