Temperature cycling effects between Sn/Pb solder and electroless copper plated AIN substrate

✍ Scribed by Bi-Shiou Chiou; Jiann-Haur Chang; Jenq-Gong Duh

• Publisher: Springer US
• Year: 1995
• Tongue: English
• Weight: 380 KB
• Volume: 6
• Category: Article
• ISSN: 0957-4522
• DOI: 10.1007/bf00144637

✦ Synopsis

Thermal cycling effects on Sn/Pb solder and electroless Cu-plated AIN substrates are investigated. X-ray diffraction patterns reveal the existence of Cu20 for the electroless Cu-plated AIN after thermal cycling in an environmental chamber. Moisture in the chamber results in the oxidation of electroless plated Cu and fracture takes place at the Cu20/Cu interface. The oxidation of Cu is also confirmed by Auger depth profile and electrical sheet resistance measurement. For the solder/Cu/AIN system, fracture occurs at the Cu/solder interface. No intermetallic compounds between solder and Cu are found after thermal cycling. Stress resulting from the thermal expansion mismatch is the major cause of loss of adhesion