Temperature cycling effects between Sn/Pb solder and thick film Pd/Ag conductor metallization : Bi-Shiou Chiou, K. C. Liu, Jenq-Gong Duh and P. Samy Palanisamy. IEEE Trans. Compon. Hybrids mfg Technol.14(1), 233 (1991)

• Publisher: Elsevier Science
• Year: 1992
• Tongue: English
• Weight: 134 KB
• Volume: 32
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(92)90239-h