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Sn-Ag-Cu and Sn-Cu solders: Interfacial reactions with platinum

✍ Scribed by Tae Hyun Kim; Young-Ho Kim


Publisher
The Minerals, Metals & Materials Society
Year
2004
Tongue
English
Weight
343 KB
Volume
56
Category
Article
ISSN
1047-4838

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Solid-state reactions between Ni and Sn–
✍ W.C. Luo; C.E. Ho; J.Y. Tsai; Y.L. Lin; C.R. Kao πŸ“‚ Article πŸ“… 2005 πŸ› Elsevier Science 🌐 English βš– 720 KB

It had been reported that, during the reflow of the Sn-Ag-Cu solders over the Ni-bearing surface finishes, a slight variation in Cu concentration produced different reaction products at the interface. In this study, we extended our earlier efforts to investigate whether this strong Cu concentration