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Simulation of the stresses produced in large-diameter silicon wafers during thermal annealing

✍ Scribed by M. V. Mezhennyi; M. G. Mil’vidskii; A. I. Prostomolotov

Book ID: 110135844
Publisher: SP MAIK Nauka/Interperiodica
Year: 2003
Tongue: English
Weight: 225 KB
Volume: 45
Category: Article
ISSN: 1063-7834
DOI: 10.1134/1.1620089

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