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Simulation of hydrogen penetration intop-type silicon under wet chemical etching

โœ Scribed by O. V. Feklisova; E. B. Yakimov; N. A. Yarykin


Book ID
110129612
Publisher
Springer
Year
2002
Tongue
English
Weight
54 KB
Volume
36
Category
Article
ISSN
1063-7826

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โœ H. Camon; Z. Moktadir; M. Djafari-Rouhani ๐Ÿ“‚ Article ๐Ÿ“… 1996 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 384 KB

A new atomic scale model has been developed to simulate anisotropic etching of silicon in KOH solutions. This model is based on the influence of the number of hydroxide groups attached to atoms. Etch rates and macroscopic activation energies have been calculated and compared with experimental data.