Silicon trench undercutting caused by the preferential plasma etching of surface-implanted-regions

✍ Scribed by Shenai, K.

• Book ID: 114534532
• Publisher: IEEE
• Year: 1992
• Tongue: English
• Weight: 259 KB
• Volume: 39
• Category: Article
• ISSN: 0018-9383
• DOI: 10.1109/16.123503