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Shear Mode Wire Failures in Plastic-Encapsulated Transistors

✍ Scribed by Basseches, H.; D'Altroy, F.


Book ID
117911184
Publisher
IEEE
Year
1978
Tongue
English
Weight
718 KB
Volume
1
Category
Article
ISSN
0148-6411

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Wire sweep, a problem in plastic encapsulated IC packages, is investigated with real encapsulated packages. For the mechanical characteristics of the wire, the wire sweep becomes smaller for a wire with a larger Youngs modulus, as expected [1]. In regard to the characteristics of the molding compoun