✦ LIBER ✦
Wire-bond failure mechanisms in plastic encapsulated microcircuits and ceramic hybrids at high temperatures
✍ Scribed by Frøydis Oldervoll; Frode Strisland
- Book ID
- 108210469
- Publisher
- Elsevier Science
- Year
- 2004
- Tongue
- English
- Weight
- 446 KB
- Volume
- 44
- Category
- Article
- ISSN
- 0026-2714
No coin nor oath required. For personal study only.