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Resolution of the Gold Wire Grain Growth Failure Mechanism in Plastic Encapsulated Microelectronic Devices

✍ Scribed by James, H.

Book ID: 117911322
Publisher: IEEE
Year: 1980
Tongue: English
Weight: 812 KB
Volume: 3
Category: Article
ISSN: 0148-6411
DOI: 10.1109/tchmt.1980.1135622

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