✦ LIBER ✦

Shear deformation of indium solder joints

✍ Scribed by Darveaux, R.; Turlik, I.

Book ID: 117872795
Publisher: IEEE
Year: 1990
Tongue: English
Weight: 996 KB
Volume: 13
Category: Article
ISSN: 0148-6411
DOI: 10.1109/33.62558

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Thermal cycling induced plastic deformat

Thermal cycling induced plastic deformation in solder joints. II. Accumulated deformation in through hole joints

✍ Pan, T.-Y. 📂 Article 📅 1991 🏛 IEEE 🌐 English ⚖ 831 KB

Analysis of high speed shear characteris

Analysis of high speed shear characteristics of Sn-Ag-Cu solder joints

✍ Santosh Kumar; Jae Yong Park; Jae Pil Jung 📂 Article 📅 2011 🏛 The Korean Institute of Metals and Materials 🌐 English ⚖ 904 KB

Deformation properties of indium-based s

Deformation properties of indium-based solders at 294 and 77 K

✍ M. Plötner; B. Donat; A. Benke 📂 Article 📅 1991 🏛 Elsevier Science 🌐 English ⚖ 606 KB

Indium-based solders are advantageously applied to joining hybrid modules in cooled electronics. To characterize their mechanical behaviour down to cryogenic temperatures tensile and shear tests were carried out at room and liquid nitrogen temperature. Bulk material specimens of pure indium and indi

Microstructure and Creep Deformation of

Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints

✍ Min He; Sylvester N. Ekpenuma; Viola L. Acoff 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 901 KB

Aging effects on shear fatigue life and

Aging effects on shear fatigue life and shear strength of soldered thick film joints

✍ Li, G.Y.; Chan, Y.C. 📂 Article 📅 1998 🏛 IEEE 🌐 English ⚖ 679 KB

Preparation of soft solder joints

✍ Günter Grossmann; Giovanni Nicoletti 📂 Article 📅 1996 🏛 Elsevier Science 🌐 English ⚖ 774 KB