Deformation properties of indium-based solders at 294 and 77 K

✍ Scribed by M. Plötner; B. Donat; A. Benke

• Publisher: Elsevier Science
• Year: 1991
• Tongue: English
• Weight: 606 KB
• Volume: 31
• Category: Article
• ISSN: 0011-2275
• DOI: 10.1016/0011-2275(91)90169-w

✦ Synopsis

Indium-based solders are advantageously applied to joining hybrid modules in cooled electronics. To characterize their mechanical behaviour down to cryogenic temperatures tensile and shear tests were carried out at room and liquid nitrogen temperature. Bulk material specimens of pure indium and indium-based eutectic alloys were tested, as well as PbSn solders for comparison. Special test apparatus was developed which was capable of rapid measuring. The elastic-plastic transition was sufficiently resolved to determine yield strengths with a shape-determined sample fixture. Stress-strain relations and figures of merit averaged over several specimens are reported. InBiSn was found to have a distinctly lower ductility than that reported to-date in the literature; on the contrary InBi proved to be an excellent ductile packaging material.