Indium-based solders are advantageously applied to joining hybrid modules in cooled electronics. To characterize their mechanical behaviour down to cryogenic temperatures tensile and shear tests were carried out at room and liquid nitrogen temperature. Bulk material specimens of pure indium and indi
Compressive properties of continuous alumina fibre/epoxy at 295 K and 77 K
β Scribed by Y.H. Gu
- Publisher
- Elsevier Science
- Year
- 1992
- Tongue
- English
- Weight
- 389 KB
- Volume
- 32
- Category
- Article
- ISSN
- 0011-2275
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