✦ LIBER ✦
Thermal cycling induced plastic deformation in solder joints. II. Accumulated deformation in through hole joints
✍ Scribed by Pan, T.-Y.
- Book ID
- 114560280
- Publisher
- IEEE
- Year
- 1991
- Tongue
- English
- Weight
- 831 KB
- Volume
- 14
- Category
- Article
- ISSN
- 0148-6411
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