𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Semiconductor wafer bonding

✍ Scribed by Dr. V. Lehmann; Dr. I. W. K. Ong; Prof. U. Gösele; Dr. R. Stengl; Dr. K. Mitani


Book ID
101411530
Publisher
John Wiley and Sons
Year
1990
Tongue
English
Weight
297 KB
Volume
2
Category
Article
ISSN
0935-9648

No coin nor oath required. For personal study only.


📜 SIMILAR VOLUMES


Semiconductor wafer bonding
✍ Reiche, M. 📂 Article 📅 2006 🏛 John Wiley and Sons 🌐 English ⚖ 648 KB

## Abstract When mirror‐polished, flat, and clean wafers are brought into contact, they are locally attracted to each other and adhere or bond. This phenomenon is known as semiconductor wafer bonding. Different adhesion forces (van der Waals forces, hydrogen bonding) are the reason for the bonding

LED wafer-level bonding
📂 Article 📅 2005 🏛 Elsevier Science 🌐 English ⚖ 144 KB

Labsphere Inc introduced the newest addition to its SLMS series of spectral light measurement systems, the SLMS LED. SLMS LED software guides users through testing, providing results in milliseconds, including total spectral flux, luminous flux, chromaticity, colour rendering index (CRI), and domin