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Wafer-to-wafer bonding for microstructure formation

✍ Scribed by Schmidt, M.A.


Book ID
118186835
Publisher
IEEE
Year
1998
Tongue
English
Weight
257 KB
Volume
86
Category
Article
ISSN
0018-9219

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In advanced microsystems various types of devices (metal-oxide semiconductor field-effect transistors, bipolar transistors, sensors, actuators, microelectromechanical systems, lasers) may be on the same chip, some of which are 3D structures in nature. Therefore, not only materials combinations (inte