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Secondary Current Crowding Effect during Electromigration of Flip-Chip Solder Joints

โœ Scribed by J.W. Jang; L.N. Ramanathan; J. Tang; D.R. Frear


Book ID
107455064
Publisher
Springer US
Year
2007
Tongue
English
Weight
303 KB
Volume
37
Category
Article
ISSN
0361-5235

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